ACPL-M61T-500E

The ACPL-M61T-500E Optocoupler Logic Gate is a highly reliable and temperature-resistant solution designed for automotive applications. With its wide operating temperature range (-40°C to 125°C), advanced common-mode rejection (15 kV/s at VCM = 1000 V), and compact auto-insertable design, it addresses the stringent requirements of the automotive industry. The device ensures high-speed data transmission (10MBd), coupled with low power consumption (6.5mA LED drive current) and minimal propagation delay (100ns max). Additionally, it holds worldwide safety approvals (UL 1577, CSA, IEC/EN/DIN EN 60747-5-2) and is qualified to AEC-Q100 standards, making it a robust and compliant solution for enhancing communication interfaces in automotive electronic systems.

·Automotive CANBus Communications Interface

·High Temperature Digital Signal Isolation

·Micro-controller Interface Digital isolation for A/D, D/A conversion

This small outline wide operating temperature, high CMR, high speed, logic gate optocoupler is a single channel device in a five lead miniature footprint.

The ACPL-M61T optically coupled gates combine a AlGaAs light emitting diode and an integrated high gain photo detector. The output of the detector IC is an Open-collector Schottky-clamped transistor. The internal shield provides a guaranteed common mode transient immunity specification of 15,000 V/μs at VCM=1000V.

This optocoupler is suitable for use in automotive high speed communications logic interfacing with low propagation delays, input/output buffering and is recommended for use in high operating temperature environment. This unique design provides maximum AC and DC circuit isolation while achieving TTL compatibility. The optocoupler AC and DC operational parameters are guaranteed from -40°C to 125°C.

Avago R2Coupler isolation products provide the reinforced insulation and reliability needed for critical in automotive and high temperature industrial applications.

It is advised that normal static precautions be taken in handling and assembly of this component to prevent damage and/or degradation which may be induced by ESD.

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